(1) Maintain solution stability
It is very important that the electroless copper plating solution is stable. In order to improve the stability of the bath, in addition to adding the stabilizer, the following points must also be noted.
1 Care should be taken to keep the bath clean. Continuous filtration or periodic filtration should be used to remove copper particles and other impurities from the bath. In the non-metal plating, the sensitized liquid and the activating liquid should be prevented from being brought in, and the plating on the groove wall should be removed in time.
When the bath is not used, use dilute sulfuric acid to adjust the pH to 9-10. When using, dilute sodium hydroxide solution to adjust the pH to the normal range.
3 When feeding, the material must be diluted with a solution and added with stirring.
4 If the bath is heated, a water jacket jacket should be used to prevent local overheating of the bath.
(2) Appropriate control of the load
The loading amount of electroless copper plating should be appropriate. If it is too high, it will cause decomposition of the plating solution. If it is too low, it will reduce the production efficiency. Its loading is generally controlled at 2~3dm2/L.
(3) Bath stirring
The stirring of the electroless copper plating solution is preferably performed using air agitation, so that the formation of Cu20 can be suppressed and the bubbles generated on the surface of the plated part can be excluded.
(4) Regularly analyze and adjust bath
The bath should be periodically analyzed. If conditions are available, it is best to use automatic control of bath composition and operating conditions. If the conditions are not enough, you can periodically replace some of the old bath with the old bath to maintain and adjust the bath.
It is very important that the electroless copper plating solution is stable. In order to improve the stability of the bath, in addition to adding the stabilizer, the following points must also be noted.
1 Care should be taken to keep the bath clean. Continuous filtration or periodic filtration should be used to remove copper particles and other impurities from the bath. In the non-metal plating, the sensitized liquid and the activating liquid should be prevented from being brought in, and the plating on the groove wall should be removed in time.
When the bath is not used, use dilute sulfuric acid to adjust the pH to 9-10. When using, dilute sodium hydroxide solution to adjust the pH to the normal range.
3 When feeding, the material must be diluted with a solution and added with stirring.
4 If the bath is heated, a water jacket jacket should be used to prevent local overheating of the bath.
(2) Appropriate control of the load
The loading amount of electroless copper plating should be appropriate. If it is too high, it will cause decomposition of the plating solution. If it is too low, it will reduce the production efficiency. Its loading is generally controlled at 2~3dm2/L.
(3) Bath stirring
The stirring of the electroless copper plating solution is preferably performed using air agitation, so that the formation of Cu20 can be suppressed and the bubbles generated on the surface of the plated part can be excluded.
(4) Regularly analyze and adjust bath
The bath should be periodically analyzed. If conditions are available, it is best to use automatic control of bath composition and operating conditions. If the conditions are not enough, you can periodically replace some of the old bath with the old bath to maintain and adjust the bath.